| Parent stator envelope | OD 30-800 mm; ID 25 mm min.; axial height 5-110 mm | The segment is reviewed against the assembled stator envelope, not only as an isolated tooth. |
| Segment / tooth position count | 3-112 positions around the stator | Repeatability, cumulative pitch error, and fixture access become more important at high count. |
| Segment shape families | Circular arc segment, sector/fan segment, individual tooth module, grouped tooth module, or YASA-style tooth module when buyer topology and IP boundary allow | Shape selection should be tied to compaction direction, demolding, winding access, magnetic path, retention, and inspection datum access. |
| Tooth and segment CTQs | Tooth height, tooth-head width, tooth-root radius, side-wall angle, slot opening, sector angle, draft, chamfer, datum face, and edge condition | Fragile corners and narrow tooth roots should be screened for green strength, ejection, chipping, density variation, and inspection access. |
| Pitch and air-gap control | Segment pitch, cumulative pitch error, fixture datum, assembled circularity, flatness, parallelism, and stator-to-rotor air-gap stack-up | A stable assembly fixture and inspection method should be planned before pilot sampling because small segment errors accumulate. |
| Retention / holder interface | Nonmagnetic holder, carrier, adhesive, clamp ring, overmold, potting, encapsulation, or housing feature | Mechanical retention affects datum surfaces, magnetic gap, winding sequence, thermal path, and supplier responsibility. |
| Winding access and insulation | Individual tooth winding, grouped module, bobbin, concentrated winding, flat-wire feasibility, resin coating, masking, Hi-pot, impregnation, and potting clearance | Segment shape should leave practical clearance for copper, insulation, coating thickness, thermal path, and assembly tooling. |
| Encapsulation / potting / bonding boundary | Loose segment, coated segment, carrier-ready tooth, bonded module, potted module, or buyer-assembled stator scope | Quote pressed segments, coating, bonding, potting, holder integration, and assembled-stator evidence as separate scope items. |
| Material and density planning route | Buyer-nominated or performance-selected SMC route; 7.4-7.6 g/cm3 target where geometry and compaction route allow | Density targets should be confirmed on the actual segment geometry, not copied from a public material benchmark. |
| Inspection and release package | FAI, CMM or 3D scan, CTQ table, density or weight record, crack/chip visual check, pitch fixture note, coating or Hi-pot note, and packing record | Engineering, sourcing, and SQE should agree which records are required before sample release. |